Improve wafer yield: Excellent wettability enables rapid wetting of the diamond wire surface, enhances protection for diamond wires, boosts lubrication and cooling performance. This reduces defects such as wire marks and TTV, and raises the yield of Grade A silicon wafers.

 Suitable for large-circulation cutting fluid: It features favorable wettability and low surface tension to meet surface tension requirements of large-circulation cutting fluid. Its excellent water solubility minimizes loss during large-circulation filter pressing, adapting to future development of slicing processes.

 Simplify formulation composition: With excellent surface tension performance and wettability, it can replace various wetting agents to streamline wetting agent combinations. Superior foaming and defoaming capacity lowers reliance on defoamers.

 Packaging: 200L drums, IBC totes or customized upon customer request.

 This product shall be hermetically stored in a cool, ventilated and dry indoor area, protected from sunlight and rain. The storage temperature should not be lower than 25°C. Low storage temperature may cause turbidity, phase separation or even solidification, which will not affect product performance. Prior to use, adequately heat and thoroughly mix the material inside drums or containers to ensure homogeneity.

 The surfactant is hygroscopic. Once opened, the product rapidly absorbs moisture from the ambient air. Air ingress into the drum will trigger gradual oxidation, which may lead to darker color or reduced pH value. Therefore, store the product in a cool and dry place with tight sealing, and use promptly after opening.(Under the above storage conditions, the shelf life of unopened original packaged products is 24 months starting from the production date.)